One - stop EMS Solution Provider

PCB Manufacturing Services

  • 1-40layer board from rigid PCB, rigid-flex PCB, and flexible PCB.

  • Quick turn order in 24h for prototype PCB.

  • Working time to follow your local time.

  • No minimum order quantity, even 1 piece.

  • 7/24 live sales and engineering support.

  • Sufficient raw materials in stock including KB, Shengyi, Rogers, Arlon, Nelco.

One-Stop PCBA Assembly, Surface-mount Technology Services

As a leading and professional printed circuit board manufacturing supplier in China, KF can help you solve all PCB problems, from single layer to 64 layers, from flexible to rigid-flex PCB, from prototype PCB to mass production, KF is your best Choose one. We can provide fast turnaround service for prototype PCB manufacturing and batch PCB manufacturing, our fastest lead time is 48 hours for prototype manufacturing from single layer to 10 layers, and our fastest lead time for double-sided batch manufacturing to 8 layers is 96 hours.

Why us?

● Keep your information safety

We can sign NDA and make sure your personal information only used for orders.

● No minimum requirement

No MOQ requested. You may order as 1~10pcs from us. We do not force you to buy what you do not need indeed to save your expenses.

● Quick turnaround time

24 Hours customer service, Kitted and Turn-Key options available.

● Advanced equipment

7 automated lines to handle SMT, through-hole, high-mix technology.

● Competitive price

Free samples provided, Reliable components sourcing channel.

● Delivery guarantee

99% On-Time Delivery, time is money we guarantee ensures you get what you need, when you need it.

● High quality

Fully Compliant with IPC 610-D Standards, Testing and quality assurance.

● PCB Assembly specialists

From prototypes to full production runs.

● All-in-one

PCB Fabrication, parts sourcing and PCB assembly.

Our PCB Fabrication Capability

PCBA processing capability
Item Manufacturing Capability
PCB Layers 1~64 Layer
Quality Grade IPC Class 2|IPC Class 3
Laminate/Base material FR-4|S1141|High Tg|PTFE|Ceramic PCB|Polyimide|S1000-2|IT180A|Isola-FR408HR|FR406|Isola 370 HR|Rogers|Taconic|Arlon|Halogen Free, etc.
Brand of Laminate Kingboard|ITEQ|Shengyi|Nanya|Isola|TUC|SYL|Arlon|Nelco|Taconic|Hitachi|Rogers, etc.
High Temperature Material Normal Tg: Shengyi S1141|KB6160|Huazhen H140(not suitable for lead-free process )
Middle Tg: For HDI、multilayers: SY S1000H|ITEQIT158|HuazhengH150|TU-662|SY S1150G|HuazhengH150HF|H160HF;
High Tg: For thick copper、high layer: SY S1000-2|ITEQIT180A|HuazhengH170|ISOLA: FR408R|370HR|TU-752|SY S1165
High Frequency Circuit Board Material Rogers|Arlon|Taconic|SY SCGA-500|S7136|HuazhengH5000
High Speed PCB Material SY S7439|TU-862HF|TU-872SLK|ISOLA: I-Speed, I-Tera@MT40|Huazheng:H175|H180|H380
Ink Taiyo INK (Japan)|KUANGSHUN(China)|RONGDA(China)|Coates Screen(UK)|S.M Materials(Taiwan, China)
Heat Conductivity for Alu. Boards 1.0
Chemical Rohm&Haas (US)|Atotech (Germany)|Umicore (Germany)
PCB Type and Services Prototype PCB|Rigid PCB|Flexible PCB(FPC)|Rigid-Flex PCB|HDI PCB|High Tg PCB|BGA PCB|Impedance Control PCB|IMS PCB(LED PCB Board, Aluminum PCB, Metal Core PCB)|Multilayer PCB|PCBA(PCB Assembly Service)
Max Board Size 609 * 889 mm
Board Thickness 0.1~8.0mm
Board Thickness Tolerance ±0.1mm / ±10%
Min base copper thickness Outer layer:1/3oz (12um) ~10oz|Inner layer:1/2oz~6oz
Max finished copperthickness 6 OZ
Min Mechanical Drilling Hole Size 6mil(0.15mm)
Min Laser Drilling Hole Size 3mil(0.075mm)
Min CNC Drilling Hole Size 0.15mm
Hole Wall Roughness(Max) 1.5mil
Min trace width/spacing(Inner Layer) 2/2mil(Outer layer:1/3oz,Inner layer:1/2oz) (H/H OZ base copper)
Min trace width/spacing(Outer Layer) 2.5/2.5mil (H/H OZ base copper)
Min spacing between hole to inner layer conductor 6mil
Min spacing between hole to outer layer conductor 6mil
Min annular ring for via 3mil
Min annular ring for component hole 5mil
Min BGA diameter 8mil
Min BGA pitch 0.4mm
Min Finished hole size 0.15mm(CNC)|0.1mm(Laser)
Half Hole Diameter Minimum Half hole Diameter: 1mm, Half hole is a special technology, so half hole diameter should be greater than 1mm.
Hole Wall Copper Thickness (Thinnest) ≥0.71mil
Hole Wall Copper Thickness (Average) ≥0.8mil
Minimum Air Gap 0.07mm(3mil)
Fine SMD Pitch 0.07mm(3mil)
Max aspect ratios 20:01
Min soldermask bridge width 3mil
Soldermask/circuit processing method Film|LDI
Min thickness for insulating layer 2mil
HDI & special type PCB HDI(1-3 steps)|R-FPC(2-16 layers)|High frequency mix-pressing(2-14 layers)|Buried capacitance & resistance …
Max. PTH (Round Hole) 8mm
Max. PTH (Round Slot Holes) 6*10mm
PTH Deviation ±3mil
PTH Deviation (Width) ±4mil
PTH Deviation (Length) ±5mil
NPTH Deviation ±2mil
NPTH Deviation (Width) ±3mil
NPTH Deviation (Length) ±4mil
Hole Position Deviation ±3mil
Character Types Serial Number|Barcode|QR Code
Min Character Width (Legend) ≥0.15mm, Characters width less than 0.15mm will be unidentifiable.
Min Character Height (Legend) ≥0.8mm, Characters height less than 0.8mm will be unidentifiable.
Character Width to Height Ratio (Legend) 1:5, 1:5 is the most suitable ratio for production.
Distance between Trace and Outline ≥0.3mm(12mil), Ship as individual boards: Distance between Trace and Outline ≥0.3mm, Ship as Panelized boards with V-cut: Distance between Trace and V-cut line ≥0.4mm
Panelization without Spacing0mm, Ship as Panelized boards and the spacing between boards is 0mm.
Panelization with Spacing 1.6mm, Make sure the spacing between boards should be ≥1.6mm, otherwise it will be hard to process routing.
Surface Finishes OSP|HASL|HASL Lead-Free (HASL LF)|Immersion Silver|Immersion Tin|Plated Gold|Immersion Gold(ENIG)|ENEPIG|Golden Finger+HASL|ENIG+OSP|ENIG+Golden Finger|OSP+Golden Finger, etc.
Solder-Mask Finishing Wet Film (LPI Soldermask)
Peelable Soldermask
Solder Mask Colors Green|Red|White|Black, Blue|Yellow|Orange|Purple, Gray|Transparent .etc. Matte: Green|Blue|Black, etc.
Silkscreen Colors Black|White|Yellow, etc.
Electrical Testing Fixture / Flying Probe
Other Testing AOI, X-Ray(AU&NI), Two-dimension Measurement, Hole Copper Instrument, Controlled Impedance Test(Coupon test&Third Party Report), Metalloscope, Peeling Strength Tester, Solderability Test, Logic Contamination Test
ProfileCNC Routing (±0.1mm)
CNC V-Cut(±0.05mm)
Mould-Die Punching(±0.1mm)
Special Capabilities Thick Copper, Thick Gold(5U”), Gold Finger, Blind and Buried Hole, Countersink Hole, Semi-hole, Peelable Mask, Carbon Ink, Counter sink hole, Plated board edge, Press fit hole, Control depth hole, VIA in PAD, Non-conductive resin plug hole, Plating plug hole, Coil PCB, Super Mini PCB, Peelable Mask, Controlled Impedance PCB, etc.

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