| machine | scope | Process parameters |
| Printing press GKG GLS | PCB printing seal | 50X50MM~610x510mm |
| Printing accuracy | ±0.018mm |
| Frame size | 420×520mm—737×737mm |
| PCB thickness range | 0.4-6mm |
| All-in-one machine for stacking board | PCB conveying seal | 50X50MM~400x360mm |
| Unwinding machine | PCB conveying seal | 50X50MM~400x360mm |
| YAMAHA YSM20R | When transferring 1 board | L50×W50mm ～L810×W490mm |
| SMD theoretical speed | 95,000CPH ( 0.027sec / CHIP ) |
| Mounting range | 0201(mm)-45*45mm component mounting height: less than 15mm |
| Mounting accuracy | CHIP±0.035mm ( ±0.025mm ) Cpk ≧ 1.0 ( 3σ ) |
| number of components | 140 kinds ( 8mm reel) |
| YAMAHA YS24 | When transferring 1 board | L50×W50mm ～L700×W460mm |
| SMD theoretical speed | 72,000CPH ( 0.05sec / CHIP ) |
| Mounting range | 0201(mm)-32*mm component mounting height: 6.5MM |
| Mounting accuracy | ±0.05mm(μ+3σ) 、±0.03mm(3σ) |
| number of components | 120 kinds ( 8mm reel) |
| YAMAHA YSM10 | When transferring 1 board | L50×W50mm ～L510×W460mm |
| SMD theoretical speed | 46000CPH ( 0.078sec / CHIP ) |
| Mounting range | 0201(mm)-45*mm component mounting height: 15MM |
| Mounting accuracy | ±0.035mm (±0.025mm) Cpk ≧ 1.0 (3σ) |
| number of components | 48 types ( 8mm reel) / 15 automatic IC trays |
| JT TEA--1000 | Adjustable for each dual track | W50~270MM substrate / single track adjustable W50*W450mm |
| The height of components on the PCB board | 25MM up and down |
| conveyor belt speed | 300~2000MM/MIN |
| ALeader ALD7727D AOI Online | Resolution / Visual Range / Speed | Optional: 7µm/Pixel FOV: 28.62mm x 21.00mm Standard: 15µm/Pixel FOV: 61.44mm x 45.00mm |
| Detection speed | ＜230ms/FOV |
| barcode system | Automatic barcode recognition ( 1D or 2D code ) |
| PCB size range | 50×50mm(Min) ～510×300mm(Max) |
| 1 track fixed | 1 track is fixed, 2 , 3 , 4 tracks can be adjusted, the minimum size between 2 and 3 tracks is 95mm , and the maximum size of 1 , 4 tracks is 700mm ; |
| single track | The maximum width of the track is 550mm ; for double tracks: the maximum width of both tracks is 300mm (testable width); |
| PCB thickness range | 0.2MM ~ 5mm |
| PCB top and bottom clearance | Top Side of PCB : 30 mm Bottom Side of PCB : 60 mm |
| SPI Stech | barcode system | Automatic barcode recognition ( 1D or 2D code ) |
| PCB size range | 50×50mm(Min) ～630×590mm(Max) |
| precision | 1µm, Height : 0.37µm |
| Repeatability | Less than 1µm (4sigma) Volume / Area : Less than 1% (4sigma) Height : Greater than 1µm (4sigma) |
| FOV speed | 0.3s/FOV |
| Reference point detection time | 0.5sec/pcs |
| Maximum detection height | ±550µm~1200µm |
| Bending PCB Maximum Measurement Height | ±3.5MM~±5MM |
| Minimum pad pitch | 100µm ( based on a pad with a pad height of 1500µm ) |
| Minimum measurement size | Rectangle 150µm, Round 200µm |
| SPI Stech | Component height on PCB | 40MM up and down |
| PCB board thickness | 0.4~7MM |
| Shansi XRAY inspection equipment VX1800 | Light tube voltage | 130V-160KV |
| light tube current | 0.15mA |
| System magnification | 130 kV: 1500X 160 kV: 6000X |
| Closed tube function | Closed tube optional 90KV and 130KV, high power penetration shielding layer effect is better, detection of samples below 1 micron |
| Can detect samples at 70 degree angle | System magnification up to 6000 |
| Light pipe focus size | 1um-3um |
| Stage | 650mmX540mm |
| geometric magnification | 300 times |
| BGA detection | The magnification is larger, the image is clearer, and it is easier to see BGA virtual soldering and tin cracks |
| Stage | X , Y , Z direction positioning can be carried out ; X- ray tube and X- ray detector direction positioning |
