One - stop EMS Solution Provider

PCB Assembly Capability

SMT capacity: 19 million points/day
Testing Equipment X-RAY Nondestructive Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speedChip placement speed (at best conditions) 0.036 S/piece
Mounted Component SpecificationsPasteable smallest package
Minimum device accuracy
IC type chip accuracy
Mounted PCB SpecificationsSubstrate size
Substrate thickness
throw rateResistance-capacitance ratio 0.3%
IC type without throwing material
Board TypePOP/common board/FPC/rigid-flex board/metal substrate
DIP daily production capacity
DIP plug-in production line50000 points/day
DIP post welding production line 20000 points/day
DIP test production line 50000pcs PCBA/day
Assembly processing capability
The company has more than 10 advanced assembly production lines, dust-free and anti-static air-conditioning workshop, TP dust-free workshop, equipped with aging room, test room, functional test isolation room, advanced and perfect equipment, can carry out various product assembly, packaging, testing, Aging, etc. production. Monthly production capacity can reach 150,000 to 300,000 sets/month
PCBA processing capability
projectMass processing capability Small batch processing capability
Number of layers (max) 2-18 20-30
Plate typeFR-4, Ceramic Sheet, Aluminum Base Sheet PTFE, Halogen Free Sheet, High Tg SheetPTFE, PPO, PPE
Rogers,etc TeflonE-65, ect
Sheet mixing 4 layers - 6 layers 6th floor - 8th floor
biggest size 610mm X 1100mm /
Dimensional Accuracy ±0.13mm ±0.10mm
Plate thickness range0.2mm--6.00mm0.2mm--8.00mm
Thickness tolerance ( t≥0.8mm)±8% ±5%
Thickness tolerance (t<0.8mm)±10% ±8%
Media thickness 0.076mm--6.00mm 0.076mm--0.100mm
Minimum line width 0.10mm 0.075mm
Minimum spacing 0.10mm 0.075mm
Outer copper thickness 8.75um--175um 8.75um--280um
Inner layer copper thickness 17.5um--175um 0.15mm--0.25mm
Drilling hole diameter (mechanical drill) 0.25mm--6.00mm 0.15mm--0.25mm
Hole diameter (mechanical drill) 0.20mm--6.00mm 0.10mm--0.20mm
Hole Tolerance (Mechanical Drill) 0.075mm 0.050mm
Laser Drilling Aperture 0.10mm 0.075mm
Plate thickness aperture ratio 10:1 12:1
Solder mask type Photosensitive green, yellow, black, purple, blue, ink /
Minimum Solder Mask Bridge Width 0.10mm 0.075mm
Minimum Solder Mask Isolation Ring 0.05mm 0.025mm
Plug hole diameter 0.25mm--0.60mm 0.60mm-0.80mm
Impedance tolerance ±10% ±5%
Surface treatment type Hot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card board Immersion Tin, OSP
SMT main equipment process capability
machinescope Process parameters
Printing press GKG GLS PCB printing seal 50X50MM~610x510mm
Printing accuracy ±0.018mm
Frame size 420×520mm—737×737mm
PCB thickness range 0.4-6mm
All-in-one machine for stacking board PCB conveying seal 50X50MM~400x360mm
Unwinding machine PCB conveying seal 50X50MM~400x360mm
YAMAHA YSM20R When transferring 1 board L50×W50mm ~L810×W490mm
SMD theoretical speed 95,000CPH ( 0.027sec / CHIP )
Mounting range 0201(mm)-45*45mm component mounting height: less than 15mm
Mounting accuracy CHIP±0.035mm ( ±0.025mm ) Cpk ≧ 1.0 ( 3σ )
number of components 140 kinds ( 8mm reel)
YAMAHA YS24 When transferring 1 board L50×W50mm ~L700×W460mm
SMD theoretical speed 72,000CPH ( 0.05sec / CHIP )
Mounting range 0201(mm)-32*mm component mounting height: 6.5MM
Mounting accuracy ±0.05mm(μ+3σ) 、±0.03mm(3σ)
number of components 120 kinds ( 8mm reel)
YAMAHA YSM10 When transferring 1 board L50×W50mm ~L510×W460mm
SMD theoretical speed 46000CPH ( 0.078sec / CHIP )
Mounting range 0201(mm)-45*mm component mounting height: 15MM
Mounting accuracy ±0.035mm (±0.025mm) Cpk ≧ 1.0 (3σ)
number of components 48 types ( 8mm reel) / 15 automatic IC trays
JT TEA--1000Adjustable for each dual track W50~270MM substrate / single track adjustable W50*W450mm
The height of components on the PCB board 25MM up and down
conveyor belt speed 300~2000MM/MIN
ALeader ALD7727D AOI Online Resolution / Visual Range / Speed Optional: 7µm/Pixel FOV: 28.62mm x 21.00mm Standard: 15µm/Pixel FOV: 61.44mm x 45.00mm
Detection speed <230ms/FOV
barcode system Automatic barcode recognition ( 1D or 2D code )
PCB size range 50×50mm(Min) ~510×300mm(Max)
1 track fixed 1 track is fixed, 2 , 3 , 4 tracks can be adjusted, the minimum size between 2 and 3 tracks is 95mm , and the maximum size of 1 , 4 tracks is 700mm ;
single track The maximum width of the track is 550mm ; for double tracks: the maximum width of both tracks is 300mm (testable width);
PCB thickness range 0.2MM ~ 5mm
PCB top and bottom clearance Top Side of PCB : 30 mm Bottom Side of PCB : 60 mm
SPI Stechbarcode system Automatic barcode recognition ( 1D or 2D code )
PCB size range 50×50mm(Min) ~630×590mm(Max)
precision 1µm, Height : 0.37µm
Repeatability Less than 1µm (4sigma) Volume / Area : Less than 1% (4sigma) Height : Greater than 1µm (4sigma)
FOV speed 0.3s/FOV
Reference point detection time 0.5sec/pcs
Maximum detection height ±550µm~1200µm
Bending PCB Maximum Measurement Height ±3.5MM~±5MM
Minimum pad pitch 100µm ( based on a pad with a pad height of 1500µm )
Minimum measurement size Rectangle 150µm, Round 200µm
SPI StechComponent height on PCB 40MM up and down
PCB board thickness 0.4~7MM
Shansi XRAY inspection equipment VX1800 Light tube voltage 130V-160KV
light tube current 0.15mA
System magnification 130 kV: 1500X 160 kV: 6000X
Closed tube function Closed tube optional 90KV and 130KV, high power penetration shielding layer effect is better, detection of samples below 1 micron
Can detect samples at 70 degree angle System magnification up to 6000
Light pipe focus size 1um-3um
Stage 650mmX540mm
geometric magnification 300 times
BGA detection The magnification is larger, the image is clearer, and it is easier to see BGA virtual soldering and tin cracks
Stage X , Y , Z direction positioning can be carried out ; X- ray tube and X- ray detector direction positioning

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