Data Sheet
PCB Assembly Name：Industrial Control and Consumer Electronics OEM PCB Assembly Manufacturer
Surface Finishing：HASL, Enig, OSP, Immersion Au, AG, Sn
PCBA-Testing：X-ray, Aoi
Type：Rigid Circuit Board
Flame Retardant Properties：V0
Processing Technology：Electrolytic Foil
Insulation Materials：Organic Resin
Material：Complex
Transport Package：Packed in Carton
Specification：Copper
Layer：1-18 Layer
Copper Thickness：0.5oz-6oz
Board Thickness：0.2mm-4mm
Min.Hole Size：0.1mm (4 Mil)
Min.Line Spacing：0.1mm (4 Mil)
PCBA QC：X-ray, Aoi Test, Function Test(100% Test)
Specialised：Consumer, LED, Medical, Industrial, Control Board
Delivery：PCB, 7-10 Days;PCBA, 2-3weeks
Service：PCBA/PCB Assembly/PCB Circuit Board
Other Service：PCB/PCB Layout and Design, Engineering Support
Product Details
Who we are?
KFEMS was founded in 2005,we are a manufacturer who are specialized in PCB Assembly (SMT, DIP, AI) and electronic product final assembly (EMS) in the top market for global customers.
We have more than 10 years of SMT manufacturing experience, well appointed SMT ,DIP and assembly lines, offering one stop service from SMT,FPC,DIP,EMS, conformal coating, testing, final assembly, component procurement ,design, peripheral products support and so on. we are equipped with High-speed and accurately SMT Equipment ,and we provide a whole range of SPI,AOI,ICT,FCT,X-RAY,ROHS and aging testing for products. All ourshop floors are dust free, all lines are lead free, we are ISO9001 certified company.
We open bom cost quotation,with high quality control strategy and 8D analysis method,we focus on top market customers, such as PCBAs on medical , industrial , financial,robotic,automobile , New Energy.
We service for many global customers,such as the globe leader in grain processing and a leading solution provider;the top 3 in medical industry customer in China; the global leader in Telehealth Sensors industry and so on.
What we can do?
PCB capability and services:
1. Single-sided, double side & multi-layer PCB. FPC. Flex Rigid PCB with competitive price,
good quality and excellent service.
2. CEM-1, CEM-3 FR-4, FR-4 High TG, Aluminum base material, Polyimide, etc.
3. HAL, HAL lead free, Immersion Gold/ Silver/Tin, OSP surface treatment.
4. Quantities range from sample to mass order
5. 100% E-Test
SMT(Surface Mounting technology),DIP.
1. Material Sourcing Service
2. SMT assembly and Through hole components insertion
3.100% AOI testing
4. IC pre-programming / Burning on-line
5.ICT testing
6.Function testing as requested
7.Complete Unit assembly (which including plastics, metal box, Coil, cable inside etc)
8.Conformal coating
9.OEM/ODM also welcomed
Production Capacity
PCB Max. size
DIP capacity
Min component size
0201
Min.pin space of IC
0.3mm
Min. space of BGA
0.3mm
Max.precision of IC assembly
±0.03mm
SMT capacity
≥2 million points/day
DIP capacity
≥100k parts/day
EMS Capacity
electronic product final assembly
100k/month
